Nidec Advance Technology to Showcase Leading Inspection Technologies at HKPCA Show 2024
Shenzhen, China - Nidec Advance Technology Corporation ("Nidec Advance Technology" or "the Company") announced today that it will exhibit a range of cutting-edge observation and detection technologies for high-end circuit boards at the HKPCA Show 2024, an international trade show taking place from December 4-6, 2024, at the Shenzhen World Exhibition & Convention Center.
The highly anticipated event is geared towards showcasing the latest innovations in China's PCB (Printed Circuit Board) industry, featuring over 600 key players from mainland China, Taiwan, Hong Kong, and other regions. At this year's show, Nidec Advance Technology aims to further solidify its presence in the Chinese market where AI technology is experiencing rapid growth.
This November marks a crucial milestone for the electronics industry as increasingly complex circuit boards are being miniaturized at an incredible pace, while their mounting process has become increasingly complicated. In support of this rapid evolution, Nidec Advance Technology will be showcasing a suite of advanced technologies designed to tackle such challenges.
Among these cutting-edge solutions, SREC-M1, the Company's newly developed electricity inspection equipment for HDI (High Density Interconnect) boards, guarantees high-speed performance and cost-effectiveness for middle-class boards. Although originally intended for high-end applications, SREC-M1 offers a solution geared towards increasing efficiency in more budget-friendly settings.
Nidec Advance Technology's exhibit will also feature GATS/SREC series for detecting short circuits on HDI/PCB boards; the GATS78 series, designed to address conduction inspections for advanced package systems; NSW high-precision optical wafer inspection equipment and more.
As an integral part of its ecosystem offering, the Company has prepared additional showcases featuring products such as:
High-speed inspection jigs
NATS, featuring a comprehensive set up for automotive IGBT/SiC power modules
- A full range of E-Transport Simulator packages that simulate e-Vehicles modeling The company is also planning to highlight innovative solutions aimed at enhancing the efficiency of automobiles' motors. This technology enhances automotive applications across multiple systems that offer improved environmental sustainability.
More details regarding Nidec Advance Technology's participation and exhibit booth location can be found on the official website at: https://www.hkpcashow.org/en